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Articles (32)

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1-10 of 32 results for solder creep

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Select article: Using carbon nanotubes to enhance creep performance of lead free solder

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Research article

First published 2008-4

Using carbon nanotubes to enhance creep performance of lead free solder

S. M. L. Nai, J. Wei, M. Gupta

Materials Science and Technology

Select article: Impression creep behaviour of tin based lead free solders

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Research article

First published 2004-7

Impression creep behaviour of tin based lead free solders

S. Devaki Rani, G.S. Murthy

Materials Science and Technology

Select article: Creep of dilute tin based lead free solder alloys as replacements of Sn–Pb solders

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Research article

First published 2008-7

Creep of dilute tin based lead free solder alloys as replacements of Sn–Pb solders

R. Mahmudi, A. R. Geranmayeh, H. Noori [...]

Materials Science and Technology

Select article: Impression creep behaviour of tin based lead free solders

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Research article

First published 2004-3

Impression creep behaviour of tin based lead free solders

S. Devaki Rani, G. S. Murthy

Materials Science and Technology

Select article: Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

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Research article

First published 2014-4

Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

A. F. Abd El-Rehim, H. Y. Zahran

Materials Science and Technology

Select article: Effect of Zn addition on steady state creep characteristics of Sn–3·3Ag solder alloy

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Research article

First published 2008-4

Effect of Zn addition on steady state creep characteristics of Sn–3·3Ag solder alloy

A. Fawzy, N. Habib, M. Sobhy [...]

Materials Science and Technology

Select article: Impression creep of Sn–40Pb–2·5Sb peritectic solder alloy

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Research article

First published 2005-7

Impression creep of Sn–40Pb–2·5Sb peritectic solder alloy

A. Rezaee-Bazzaz, R. Mahmudi

Materials Science and Technology

Select article: Effect of isothermal aging on room temperature impression creep of lead free Sn–9Zn and Sn–8Zn–3Bi solders

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Research article

First published 2010-8

Effect of isothermal aging on room temperature impression creep of lead free Sn–9Zn and Sn–8Zn–3Bi solders

R. Mahmudi, A. R. Geranmayeh, H. Noori [...]

Materials Science and Technology

Select article: Experimental study and constitutive analysis of compressive creep behavior of solder material in IGBT modules

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Research article

First published 2025-12

Experimental study and constitutive analysis of compressive creep behavior of solder material in IGBT modules

Shaoqing Liu, Yuda Cao, Li Chen [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

Select article: Modification of Sn58Bi solder based on graphite

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First published 2014-6

Modification of Sn58Bi solder based on graphite

L. Yang, C. Du, N. Zhang [...]

Materials Science and Technology

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