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1-2 of 2 results for nanoelectronics packaging

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Select article: Simulating Damage Mechanics of Electromigration and Thermomigration

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Research article

First published August, 2008

Simulating Damage Mechanics of Electromigration and Thermomigration

Shidong Li, Mohd F. Abdulhamid, Cemal Basaran

SIMULATION

Select article: Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions

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Research article

First published 2021

Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions

Zhao Zhang, Sheng Liu, Kun Ma [...]

International Journal of Damage Mechanics

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