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multidirectional envelope forming
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Select article: Multidirectional envelope forming of copper component with thin baseboard and high ribs
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Research article
First published 2025
Multidirectional envelope forming of copper component with thin baseboard and high ribs
Xinghui Han,
Xinhong Yuan,
Duanyang Tian
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Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture
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