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Research article

First published 2000-7

The mechanical properties of lead-containing and lead-free solders—meeting the environmental challenge

W J Plumbridge, C R Gagg

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

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Research article

First published 2006-04

Isothermal Fatigue Damage Model for Lead-free Solder

Yong Wei, C. L. Chow, Paul Vianco [...]

International Journal of Damage Mechanics

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Research article

First published 2008-4

Using carbon nanotubes to enhance creep performance of lead free solder

S. M. L. Nai, J. Wei, M. Gupta

Materials Science and Technology

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Research article

First published 2009-10

Comparison of Inelastic Behaviors of Lead-Free and Sn—Pb Solder Joints

Hsin-Chun Tsai, Wen-Ren Jong, Hsiu-Tao Chang

Journal of Reinforced Plastics and Composites

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Research article

First published 2004-7

Impression creep behaviour of tin based lead free solders

S. Devaki Rani, G.S. Murthy

Materials Science and Technology

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Research article

First published 2023-11

Nonlinear finite element simulations on the mechanical response of the isothermally aged lead-free solders

Mohammad A Gharaibeh

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

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Research article

First published 2008-7

Creep of dilute tin based lead free solder alloys as replacements of Sn–Pb solders

R. Mahmudi, A. R. Geranmayeh, H. Noori [...]

Materials Science and Technology

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Research article

First published 2013-12

Solder joint reliability of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

Satyanarayan, K N Prabhu

Materials Science and Technology

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Research article

First published 2022-9

Enhancing the tensile properties of Sn-Zn-Ag lead-free solder alloy by loading MgO nanoparticles and irradiation

Gh Mohammed, F Alruwaili, Samy El-Gamal

Journal of Composite Materials

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Research article

First published 2013-4

Comparison of spreading behaviour and interfacial microstructure in Sn–0·7Cu,Sn–0·3Ag–0·7Cu and Sn–2·5Ag–0·5Cu lead free solder alloys on Fe–42Ni substrate

S Narayan, K N Prabhu

Materials Science and Technology

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