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Research article

First published 1993-5

Characterisation of Silver Filled Adhesives for Attachment of Microelectronic Chips to Substrates

Are Bjorneklett

Polymers and Polymer Composites

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Research article

First published 1993-5

Characterisation of Silver Filled Adhesives for Attachment of Microelectronic Chips to Substrates

Are Bjorneklett

Polymers and Polymer Composites

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Research article

First published 2015-7

Improving performances of microchannels in microfluidic chip using solidifiable adhesive film

J. Wu, W. Guo, C. Wang [...]

Surface Engineering

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Research article

First published 2010

Time-Dependent Metabolic Activity and Adhesion of Human Osteoblast-Like Cells on Sensor Chips with a Plasma Polymer Nanolayer

Henrike Rebl, Birgit Finke, Karsten Schroeder [...]

The International Journal of Artificial Organs

Free access

Research article

First published 2005-1

Slipline field solutions for metal machining with adhesion friction and elastic effects at the chip-tool contact region

N S Das, S T Dundur

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2013

Chip Seal Adhesion Performance with Modified Binder in Cold Climates

Bekir Aktaş, Mustafa Karaşahin

Transportation Research Record: Journal of the Transportation Research Board

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Research article

First published 2016-8

Removal analyses of chip and rod in rotary ultrasonic-assisted drilling of carbon fiber-reinforced plastics using core drill

Zhe Li, Deyuan Zhang, Wei Qin [...]

Journal of Reinforced Plastics and Composites

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Research article

First published 2014-5

Comparison of drill wear mechanism between rotary ultrasonic elliptical machining and conventional drilling of CFRP

Daxi Geng, Deyuan Zhang, Yonggang Xu [...]

Journal of Reinforced Plastics and Composites

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Research article

First published 2016-1

Fluorescence detection test by black printed circuit board based microfluidic channel for polymerase chain reaction

Ji-Soo Hwang, Yu-Seop Kim, Hye-Jeong Song [...]

Technology and Health Care

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Research article

First published 2004-1

Thermal stress induced by the adhesion topology of a semiconductor integrated circuit package

D C Lee, M G Kim, J I Lee

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

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