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Select article: Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering

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Research article

First published October, 2022

Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering

J. Ren, M. L. Huang

Science and Technology of Welding and Joining

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