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Research article

First published 2005-4

Thermal analysis and optimization for a ball grid array package

C-I Ho, T-C Hung, C-I Hung

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2011-12

Optimal design of thin-profile fine-pitch ball grid array package under drop impact test

R S Chen, H E Cheng, R W Wu [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2004-9

Hygrothermal stress analysis of a plastic ball grid array package during solder reflow

K-C Chang, M-K Yeh, K-N Chiang

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 1995-1

Fast Identification of Packaging Waste by near Infrared Spectroscopy with an InGaAs Array Spectrograph Combined with Neural Networks

Roger Feldhoff, Thomas Huth-Fehre, Thomas Kantimm [...]

Journal of Near Infrared Spectroscopy

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Research article

First published 2007-01

Thermal Study of Enhanced Plastic Ball Grid Array Package with Flat Heat Spreader

T. P. Huang, G. H. Wu

Journal of Reinforced Plastics and Composites

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Research article

First published 2024-4

Design and simulation of a flexible piezoelectric sensing array with stable sensitivity and high duty cycle

Xin Wang, Tongtong Kang, Jiale Zhang [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2019-10

Toward reproducible disease models using the Systems Biology Markup Language

Leandro Watanabe, Jacob Barhak, Chris Myers

SIMULATION

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Research article

First published 2006-1

Growth analysis of interfacial delamination in a plastic ball grid array package during solder reflow using the global–local finite element model

K-C Chang, K-N Chiang

The Journal of Strain Analysis for Engineering Design

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Research article

First published 2004-2

Residual Stress Mapping of Epoxy Molding Compound in a Ball Grid Array Microelectronic Package Using a Fluorescent Sensor

Naoki Muraki, Nobuhiro Matoba, Takayuki Hirano [...]

Applied Spectroscopy

Open access

Research article

First published 2006

Computational Methods for the Analysis of Array Comparative Genomic Hybridization

Raj Chari, William W. Lockwood, Wan L. Lam

Cancer Informatics

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