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Research article

First published 2020-12

Simulation of a micro-milling single crystal copper process based on crystal plastic constitutive theory

Luan Yihan, Meng Xiangyue, Xue Liang [...]

SIMULATION

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Research article

First published 2019-8

Investigation of tool geometry in nanoscale cutting single-crystal copper by molecular dynamics simulation

Houfu Dai, Hao Du, Jianbin Chen [...]

Proceedings of the Institution of Mechanical Engineers,Part J: Journal of Engineering Tribology

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Research article

First published 2025-12

Investigation on the effect of probe stiffness on surface roughness in single crystal copper nanomachining process

Hojjatollah Tavari, Mohammad Mahdi Jalili

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 1969-1

The Cyclic Hardening of Copper Single Crystals

D. Shinozaki, J. D. Embury

Materials Science and Technology

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Research article

First published 1978-4

Sulphur diffusion in silver and copper single crystals

J. Ladet, B. Aufray, F. Maya

Materials Science and Technology

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Research article

First published 1971-1

Some Observations on Fatigue in Copper Single Crystals

C. R. Gostelow

Materials Science and Technology

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Research article

First published 1979-3

Dynamic recrystallization in tension-deformed copper single crystals

G. Gottstein, D. Zabardjadi, H. Mecking

Materials Science and Technology

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Research article

First published 2023-11

Anisotropy of nanoindentation in copper single crystals under different orientations

Maohong Yang, Jiankang Huang, Yulong Liu [...]

Materials Science and Technology

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Research article

First published 2010-6

Experimental investigation on micromilling of oxygen-free,high-conductivity copper using tungsten carbide,chemistry vapour deposition,and single-crystal diamond micro tools

D Huo, K Cheng

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2012-10

Inception of plasticity in copper single crystal in presence of stacking fault tetrahedra

I. Salehinia, D. F. Bahr

Materials Science and Technology

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