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Articles (45)

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1-10 of 45 results for SNS fatigue

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Select article: Fatigue crack propagation behaviour and corrosion resistance of Al–Zn–Mg–Cu–Ti(–Sn) alloys

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Research article

First published 2013-3

Fatigue crack propagation behaviour and corrosion resistance of Al–Zn–Mg–Cu–Ti(–Sn) alloys

A Yan, L Chen, H S Liu [...]

Materials Science and Technology

Select article: Effect of fine dispersoids and anisotropic nature of β -Sn on thermal fatigue properties of flip chips connected by Sn– x Ag–0·5Cu ( x : 1,3 and 4 mass-%) lead free solders

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Research article

First published 2009-7

Effect of fine dispersoids and anisotropic nature of β -Sn on thermal fatigue properties of flip chips connected by Sn– x Ag–0·5Cu ( x : 1,3 and 4 mass-%) lead free solders

S. Terashima, M. Tanaka

Science and Technology of Welding and Joining

Select article: Effect of crystallographic anisotropy of β -tin grains on thermal fatigue properties of Sn–1Ag–0˙5Cu and Sn–3Ag–0˙5Cu lead free solder interconnects

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Research article

First published 2008-11

Effect of crystallographic anisotropy of β -tin grains on thermal fatigue properties of Sn–1Ag–0˙5Cu and Sn–3Ag–0˙5Cu lead free solder interconnects

S. Terashima, T. Kobayashi, M. Tanaka

Science and Technology of Welding and Joining

Select article: Fatigue crack propagation in Al–Sn bearing alloys

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Research article

First published 1989-7

Fatigue crack propagation in Al–Sn bearing alloys

A. K. Busby, J. W. Martin

Materials Science and Technology

Select article: Thermal fatigue properties and grain boundary character distribution in Sn–x Ag–0˙5Cu (x = 1,1˙2 and 3) lead free solder interconnects

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Research article

First published 2008-1

Thermal fatigue properties and grain boundary character distribution in Sn–x Ag–0˙5Cu (x = 1,1˙2 and 3) lead free solder interconnects

S. Terashima, M. Tanaka, K. Tatsumi

Science and Technology of Welding and Joining

Select article: Constitutive Model for Sn–Pb Solder under Fatigue Loading

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Other

First published 2004-04

Constitutive Model for Sn–Pb Solder under Fatigue Loading

Y. Wei, C. L. Chow, M. K. Neilsen [...]

International Journal of Damage Mechanics

Select article: Influence of solder thickness on interfacial structures and fatigue properties of Cu/Sn/Cu joints

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Research article

First published 1999-7

Influence of solder thickness on interfacial structures and fatigue properties of Cu/Sn/Cu joints

H. Kato, S. Horikawa, K. Kageyama

Materials Science and Technology

Select article: Micro-Mechanics of Fatigue Damage in Pb-Sn Solder Due to Vibration and Thermal Cycling

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Research article

First published 2001-04

Micro-Mechanics of Fatigue Damage in Pb-Sn Solder Due to Vibration and Thermal Cycling

A. Dasgupta, P. Sharma, K. Upadhyayula

International Journal of Damage Mechanics

Select article: Influence of thermal cycling on fatigue strength of Cu/Sn/Cu solder joints

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Research article

First published 2001-10

Influence of thermal cycling on fatigue strength of Cu/Sn/Cu solder joints

H. Kato, T. Masaki, K. Kageyama

Materials Science and Technology

Select article: Decrease in fatigue life of Sn - 3.8 wt-%Ag - 1.2 wt-%Cu alloy solder joints due to thermal cycling

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Research article

First published 2003-10

Decrease in fatigue life of Sn - 3.8 wt-%Ag - 1.2 wt-%Cu alloy solder joints due to thermal cycling

H. Kato, K. Matsubara, K. Kageyama

Materials Science and Technology

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