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Articles (4)

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1-4 of 4 results for SN-AG-SB-CU SOLDER

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Select article: Surface tension of some Sn–Pb alloys: Part 1 Effect of Bi,Sb,P,Ag,and Cu on 60Sn–40Pb solder

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Research article

First published 1987-12

Surface tension of some Sn–Pb alloys: Part 1 Effect of Bi,Sb,P,Ag,and Cu on 60Sn–40Pb solder

M. A. Carroll, M. E. Warwick

Materials Science and Technology

Select article: Influence of Cu addition on intermetallic compound formation and microstructure of Sn–3Ag–1˙5Sb– x Cu solder joints

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Research article

First published 2008-11

Influence of Cu addition on intermetallic compound formation and microstructure of Sn–3Ag–1˙5Sb– x Cu solder joints

H. T. Lee, W. Y. Huang, Y. F. Chen

Science and Technology of Welding and Joining

Select article: Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering

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Research article

First published 2022-10

Board-level drop properties of Sn–49Bi–1Ag/Sn–3.0Ag–0.5Cu hybrid solder joints assembled by low-temperature soldering

J. Ren, M. L. Huang

Science and Technology of Welding and Joining

Select article: Influence of copper addition on adhesive strength of Sn–3Ag–1·5Sb solder joints

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Research article

First published 2004-12

Influence of copper addition on adhesive strength of Sn–3Ag–1·5Sb solder joints

H.-T. Lee, M.-H. Chen, H.-M. Jao

Science and Technology of Welding and Joining

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