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Articles (8)

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1-8 of 8 results for SN-37PB

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Select article: Correlation between displacement rate and shear force in shear test of Sn–Pb and lead free solder joints

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Research article

First published 2005-3

Correlation between displacement rate and shear force in shear test of Sn–Pb and lead free solder joints

J.-W. Kim, J. Joo, D. J. Quesnel [...]

Materials Science and Technology

Select article: Microstructure transformation of Sn base solders under isothermal aging and thermal shearing cycling conditions

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Research article

First published 2008-10

Microstructure transformation of Sn base solders under isothermal aging and thermal shearing cycling conditions

L. H. Qi, J. H. Huang, X. K. Zhao [...]

Materials Science and Technology

Select article: Creep of dilute tin based lead free solder alloys as replacements of Sn–Pb solders

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Research article

First published 2008-7

Creep of dilute tin based lead free solder alloys as replacements of Sn–Pb solders

R. Mahmudi, A. R. Geranmayeh, H. Noori [...]

Materials Science and Technology

Select article: The mechanical properties of lead-containing and lead-free solders—meeting the environmental challenge

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Research article

First published 2000-7

The mechanical properties of lead-containing and lead-free solders—meeting the environmental challenge

W J Plumbridge, C R Gagg

Proceedings of the Institution of Mechanical Engineers,Part L: Journal of Materials: Design and Applications

Select article: Thermal contact at solder/substrate interfaces during solidification

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Research article

First published 2009-6

Thermal contact at solder/substrate interfaces during solidification

S. Nyamannavar, K. N. Prabhu

Materials Science and Technology

Select article: Factors influencing current density distribution and current crowding in flip chip solder joints

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Research article

First published 2007-7

Factors influencing current density distribution and current crowding in flip chip solder joints

C. Yu, H. Lu, R. Z. Fan [...]

Science and Technology of Welding and Joining

Select article: Constitutive Model for Sn–Pb Solder under Fatigue Loading

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Other

First published 2004-04

Constitutive Model for Sn–Pb Solder under Fatigue Loading

Y. Wei, C. L. Chow, M. K. Neilsen [...]

International Journal of Damage Mechanics

Select article: The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

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Research article

First published 2007-08

The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

Hsin-Chun Tsai, Wen-Ren Jong

Journal of Reinforced Plastics and Composites

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