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Research article

First published 2003-6

Optimization of trench filling during copper electrodeposition by additives and pulse plating

M Georgiadou, D Veyret

Proceedings of the Institution of Mechanical Engineers,Part B: Journal of Engineering Manufacture

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Research article

First published 2011-10

Preparation of Co–W–P alloy films by pulse plating

Y D Yu, Z Yu, W Li [...]

Surface Engineering

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Research article

First published 2013-7

Pulse plating of platinum on aligned multiwalled carbon nanotubes

M. Schneider, M. Weiser, S. Dörfler [...]

Surface Engineering

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Research article

First published 2015-3

Pulse plating of manganese oxide nanoparticles on aligned MWCNT

M. Schneider, M. Weiser, C. Schrötke [...]

Surface Engineering

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Research article

First published 2004-6

Industrial Application of Pulsed Dc Bias Power Supplies in Closed Field Unbalanced Magnetron Sputter Ion Plating

K.E. Cooke, J. Hampshire, W. Southall [...]

Surface Engineering

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Research article

First published 2021-11

Non-linear response and buckling of imperfect laminated composite plates under in-plane pulse forces

Rajesh Kumar, Vishal Singh, SN Patel [...]

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 2019-12

Pulse plating of Pd–Ag alloy films from deep eutectic solvents

Mila Manolova, Reinhard Böck, Ingolf Scharf [...]

Surface Engineering

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Research article

First published 1961-3

Stress Distribution on the Boundary of a Circular Hole in a Large Plate during Passage of a Stress Pulse of Short Duration

W. F. Riley, A. J. Durelli

Journal of Mechanical Engineering Science

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Research article

First published 2019-7

Pulse plating of Ni–B/WC nanocomposite coating and study of its corrosion and wear resistance

Mir Ghasem Hosseini, Somayeh Ahmadiyeh, Ali Rasooli

Materials Science and Technology

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Research article

First published 2012-11

Pulse plated Zn transition layer in electroplating Zn–Ni coatings on magnesium alloys

L M Chang, W Liu, X Y Duan [...]

Surface Engineering

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