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Research article

First published 2011-8

Shear strength of Cu/In–48Sn/Cu diffusion soldered interconnections

J Wojewoda-Budka, P Zieba

Science and Technology of Welding and Joining

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Research article

First published 2009-12

Challenging gold based filler metals for uses in medicine

K. Bobzin, E. Lugscheider, F. Ernst [...]

Materials Science and Technology

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Research article

First published 2003-4

Phase characterisation and kinetic behaviour of diffusion soldered Cu/In/Cu interconnections

S. Sommadossi, W. Gust, E. J. Mittemeijer

Materials Science and Technology

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Research article

First published 2012-1

Morphology and chemical composition of Cu/Sn/Cu and Cu(5 at-%Ni)/Sn/Cu(5 at-%Ni) interconnections

A Wierzbicka-Miernik, J Wojewoda-Budka, L Litynska-Dobrzynska [...]

Science and Technology of Welding and Joining

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Research article

First published 1987-3

Diffuse Reflectance FT-IR Analysis of Rosin Flux-Metal Oxide Interactions

Randy W. Snyder

Applied Spectroscopy

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Research article

First published 2004-9

Hygrothermal stress analysis of a plastic ball grid array package during solder reflow

K-C Chang, M-K Yeh, K-N Chiang

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

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Research article

First published 1992-9

Diffusion controlled reactions in Au/Pb–Sn solder system

El-B. Hannech, C. R. Hall

Materials Science and Technology

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Research article

First published 1968-01

Electron Microscopy of Gold Soldered Joints

M. Kamal El-Ebrashi, Kamal Asgar, W.C. Bigelow

Journal of Dental Research

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Research article

First published 2004-10

Mechanical Implications of High Current Densities in Flip-chip Solder Joints

Hua Ye, Cemal Basaran, Douglas C. Hopkins

International Journal of Damage Mechanics

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Research article

First published 2004-07

Effects of Grain Boundary Sliding on Microstructural Evolution and Damage Accumulation in Tin-Lead Alloy

Y. -L. Shen, K. C. R. Abell, S. E. Garrett

International Journal of Damage Mechanics

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