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Articles (9)

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1-9 of 9 results for 63SN-37PB SOLDER

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Select article: A unified viscoplastic description of 63Sn-37Pb solder alloy under cyclic straining and stressing

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Research article

First published 2004-9

A unified viscoplastic description of 63Sn-37Pb solder alloy under cyclic straining and stressing

X J Yang, C L Chow, K J Lau

Proceedings of the Institution of Mechanical Engineers,Part C: Journal of Mechanical Engineering Science

Select article: A Unified Viscoplastic Fatigue Damage Model for 63Sn-37Pb Solder Alloy Under Cyclic Stress Control

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Other

First published 2003-07

A Unified Viscoplastic Fatigue Damage Model for 63Sn-37Pb Solder Alloy Under Cyclic Stress Control

X. J. Yang, C. L. Chow, K. J. Lau

International Journal of Damage Mechanics

Select article: Microstructure transformation of Sn base solders under isothermal aging and thermal shearing cycling conditions

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Research article

First published 2008-10

Microstructure transformation of Sn base solders under isothermal aging and thermal shearing cycling conditions

L. H. Qi, J. H. Huang, X. K. Zhao [...]

Materials Science and Technology

Select article: Constitutive Model for Sn–Pb Solder under Fatigue Loading

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First published 2004-04

Constitutive Model for Sn–Pb Solder under Fatigue Loading

Y. Wei, C. L. Chow, M. K. Neilsen [...]

International Journal of Damage Mechanics

Select article: A Damage-Coupled TMF Constitutive Model for Solder Alloy

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Research article

First published 2001-04

A Damage-Coupled TMF Constitutive Model for Solder Alloy

Yong Wei, C. L. Chow

International Journal of Damage Mechanics

Select article: Comparison of Inelastic Behaviors of Lead-Free and Sn—Pb Solder Joints

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Research article

First published 2009-10

Comparison of Inelastic Behaviors of Lead-Free and Sn—Pb Solder Joints

Hsin-Chun Tsai, Wen-Ren Jong, Hsiu-Tao Chang

Journal of Reinforced Plastics and Composites

Select article: The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

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Research article

First published 2007-08

The Significance of Underfill on the IC Packages Subjected to Temperature Cyclic Loading

Hsin-Chun Tsai, Wen-Ren Jong

Journal of Reinforced Plastics and Composites

Select article: Experimental Damage Mechanics of Microelectronics Solder Joints under Concurrent Vibration and Thermal Loading

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Research article

First published 2001-04

Experimental Damage Mechanics of Microelectronics Solder Joints under Concurrent Vibration and Thermal Loading

Cemal Basaran, Alexander Cartwright, Ying Zhao

International Journal of Damage Mechanics

Select article: Computational Algorithms for a Damage-coupled Cyclic Viscoplasticity Material Model

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Research article

First published 2009-08

Computational Algorithms for a Damage-coupled Cyclic Viscoplasticity Material Model

A.H. Zhao, C.L. Chow

International Journal of Damage Mechanics

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